Inductor bridge and electronic device

ABSTRACT

An inductor bridge is provided with a flexible flat plate-shaped element body, a first connector, and a second connector. The element body includes therein an inductor portion. The inductor portion is configured by a spiral conductor pattern. The first connector is provided on the element body and is connected to a first circuit. The second connector is provided on the element body and is connected to a second circuit.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an element that connects two circuits,and particularly to an inductor bridge including an inductancecomponent, and an electronic device including the inductor bridge.

2. Description of the Related Art

Conventionally, in a small electronic device such as a mobile terminal,in a case in which such a device is provided with mounting circuitmembers such as a plurality of substrates in a housing, as disclosed inInternational Publication No. 2005/114778, for example, the mountingcircuit members are connected by a flexible flat cable.

In a conventional electronic device including a plurality of substratesthat are connected to each other by a flat cable, the substrate includesthereon an electronic component, as needed, to configure a circuit insubstrate unit, and the flat cable is simply used as a wiring thatconnects the substrates to each other.

In such an electronic device provided with the mounting circuit memberssuch as a plurality of substrates, an inductor required for a circuit,for example, is provided by mounting a chip inductor on the substratesor by forming a conductor pattern of an inductor on the substrates.

However, in a structure in which a chip inductor is mounted on asubstrate, the substrate cannot be thin, which becomes a factor thatobstructs a reduction in size of the entire electronic device. On theother hand, in a structure (hereinafter referred to as “patterninductor”) in which a conductor pattern forms an inductor, an arearequired for a circuit on the substrate is relatively large, whichbecomes a factor that obstructs the reduction in size of the electronicdevice.

Obviously, while any of the chip inductor and the pattern inductor, if aconductive pattern to be formed is miniaturized, can achieve thereduction in size of the electronic device, this causes some problemssuch that Equivalent Series Resistance (ESR) is increased or that Qvalue is decreased.

SUMMARY OF THE INVENTION

In view of the foregoing, preferred embodiments of the present inventionprovide an inductor bridge capable of reducing a size of an electronicdevice provided with an electronic circuit including an inductor, and anelectronic device provided with such an inductor bridge.

An inductor bridge according to a preferred embodiment of the presentinvention is an element configured to bridge-connect a first circuit anda second circuit, and includes a flexible flat plate-shaped elementbody; a first connecting portion that is provided on the element bodyand connected to the first circuit; a second connecting portion that isprovided on the element body and connected to the second circuit; and aninductor portion that is connected between the first connecting portionand the second connecting portion.

With the configuration described above, since an inductor is provided inthe circuit without mounting a chip inductor and a pattern inductor to amounting circuit member such as a substrate to be connected, anelectronic device is able to be downsized. In addition, since the numberof processing steps in which the chip inductor is mounted to themounting circuit member such as a substrate is reduced, cost reductionis achieved.

The first connecting portion and the second connecting portion maypreferably be electrically connected to each other by mechanicalcontact. Accordingly, the inductor bridge is able to be used as aconnecting tool that connects circuits electrically and mechanically.

The element body may preferably be a laminate including a resin basematerial; and the resin base material may preferably be made of a liquidcrystal polymer (LCP). Accordingly, the low dielectric constantcharacteristic is utilized effectively to reduce stray capacitance, sothat the inductor bridge is able to be used as an inductor up to ahigher frequency band.

The inductor portion preferably includes, for example, a spiralconductor pattern of which the coil axis is oriented in a directionperpendicular or substantially perpendicular to the principal surface ofthe element body. Accordingly, a large inductance is obtained with thesmall number of layers, so that the planar size required to obtainnecessary inductance is reduced.

In a case in which the element body has a longer direction, the inductorportion includes, for example, a meander line-shaped conductor patternof which the lines that are adjacent to each other each extend in thelonger direction of the element body. Accordingly, the rigidity in thelonger direction is enhanced. In addition, bending at a position otherthan a position of the inductor portion becomes easy.

In a case in which the element body has a shorter direction, theinductor portion, for example, includes a meander line-shaped conductorpattern of which the lines that are adjacent to each other each extendin the shorter direction of the element body. Accordingly, theflexibility in the overall longer direction is enhanced. In addition,the amount of the change in inductance with respect to the amount of thebending of the element body is significantly reduced or prevented.

The conductor pattern preferably is provided over a plurality of layers,for example, and the conductor patterns that are provided on adjacentlayers are arranged so as not to be overlapped with each other in a planview. Accordingly, with a slight increase in stray capacitance for theincrease in inductance accompanying the increase in the number oflayers, the inductor bridge is able to be used as an inductor up to ahigher frequency band.

The conductor pattern is provided over a plurality of layers, forexample, and a plurality of conductor patterns are connected in parallelto each other. Accordingly, equivalent series resistance is reduced.

The inductor portion, for example, preferably is a helical conductorpattern of which the coil axis is oriented in a direction in parallel orsubstantially parallel to the principal surface of the element body.Accordingly, even if the conductors are adjacent to each other, an eddycurrent is hardly generated in the conductors, so that change ininductance by a surrounding environment is significantly reduced orprevented.

A magnetic body (core) may preferably be arranged near the conductorpattern in the element body. Accordingly, an inductor bridge is furtherdownsized.

The first connecting portion may preferably be provided on a first endportion of the element body; the second connecting portion maypreferably be provided on a second end portion of the element body; andthe element body may preferably include a bending portion between thefirst end portion and the second end portion. Accordingly, the inductorbridge, in a state of being bent, connects two circuits and is easilystored in a limited space in the housing of an electronic device.

The bending portion may preferably be a portion to be bent along a line(bending line) and may preferably be provided in a region in which theinductor portion is provided; and the inductor portion may preferablyhave a shape of an ellipse of which the major axis is non-perpendicularto the line. Accordingly, the conductor pattern including the inductorportion is hardly disconnected.

The bending portion may preferably be arranged at a position other thana line passing through the center of the inductor portion. Accordingly,the inductor bridge is easily bent at a highly flexible position, whichsignificantly reduces or prevents stress to the inductor portion andcauses the inductor bridge to easily maintain the characteristics as aninductor.

The bending portion may preferably include an interlayer connectionconductor (via conductor).

The element body may preferably include two shield conductor patternsthat interpose the inductor portion between the shield conductorpatterns in a laminating direction. Accordingly, the inductor portion iselectromagnetically shielded, so that stable characteristics areobtained.

The inductor portion may preferably include a conductor pattern of whichthe coil axis is oriented in a direction perpendicular or substantiallyperpendicular to the principal surface of the element body and whichpreferably has a helical shape over a plurality of layers; a pluralityof conductor patterns may preferably be provided in a position of facingeach other between the layers; and, among the plurality of conductorpatterns, a line width of the (outermost) conductor pattern that isclose to the first connecting portion on a path and a line width of the(outermost) conductor pattern that is close to the second connectingportion on a path may preferably be thinner than a line width of theconductor patterns of other layers. The configuration significantlyreduces parasitic capacitance, increases self-resonant frequency, andwidens a pass band width.

The inductor portion may preferably include a conductor pattern of whichthe coil axis is oriented in a direction perpendicular or substantiallyperpendicular to the principal surface of the element body and whichpreferably has a helical shape over a plurality of layers; a pluralityof conductor patterns may preferably be provided in a position of facingeach other between the layers; the plurality of conductor patterns maypreferably include a first (outermost) conductor pattern that is closeto the first connecting portion and the second connecting portion on apath; and a second (outermost) conductor pattern of a layer that isadjacent to the first conductor pattern; and a distance between thefirst conductor pattern and the second connecting portion may preferablybe larger than a distance between the conductor patterns in other layersthat are adjacent to the first conductor pattern. The configurationsignificantly reduces parasitic capacitance, increases self-resonantfrequency, and widens a pass band width.

An electronic device according to a preferred embodiment of the presentinvention includes an inductor bridge according to any one of thepreferred embodiments of the present invention described above; a firstcircuit; and a second circuit, and the first circuit and the secondcircuit are connected to each other through the inductor bridge.

The electronic device includes, for example, a first mounting circuitmember including the first circuit; and a second mounting circuit memberincluding the second circuit, and the first mounting circuit member andthe second mounting circuit member are provided at a different positionin a height direction; and when the inductor bridge is bent, the firstconnecting portion is connected to the first mounting circuit member,and the second connecting portion is connected to the second mountingcircuit member.

An electronic device according to a preferred embodiment of the presentinvention includes an inductor bridge according to one of the preferredembodiments of the present invention described above; a first circuit; asecond circuit; a first mounting circuit member including the firstcircuit; and a second mounting circuit member including the secondcircuit, and the first mounting circuit member and the second mountingcircuit member are provided at a different position in a heightdirection; the second mounting circuit member includes a groundconductor pattern; and the inductor bridge, when being bent, isconnected between the first mounting circuit member and the secondmounting circuit member in a state in which the coil axis of theinductor portion is arranged non-perpendicular to the face of the secondmounting circuit member. The configuration reduces or prevents undesiredcoupling between the inductor portion and a ground conductor andsignificantly reduces an eddy current generated in the ground conductor.

An electronic device according to a preferred embodiment of the presentinvention may preferably include an inductor bridge according to any oneof the preferred embodiments of the present invention described above;and a mounting circuit member (substrate) including a planar conductor(ground electrode) that is electrically connected to the firstconnecting portion, and the inductor bridge may preferably include afirst wiring pattern that is connected to the first connecting portion;and a second wiring pattern that is connected to the second connectingportion; and the second wiring pattern and the inductor portion maypreferably be provided on a layer farther away from the planar conductorthan the first wiring pattern.

An electronic device according to a preferred embodiment of the presentinvention may preferably include an inductor bridge according to any oneof the preferred embodiments of the present invention described above;and an antenna including an antenna element pattern that is electricallyconnected to the first connecting portion, and the inductor bridge maypreferably include a first wiring pattern that is connected to the firstconnecting portion; and a second wiring pattern that is connected to thesecond connecting portion; and the second wiring pattern may preferablybe provided on a layer farther away from the antenna element patternthan the first wiring pattern.

An electronic device according to a preferred embodiment of the presentinvention may preferably include an inductor bridge according to any oneof the preferred embodiments of the present invention described above;an antenna including an antenna element pattern that is electricallyconnected to the first connecting portion; and a planar conductor thatis electrically connected to the second connecting portion, and theinductor bridge may preferably include a first wiring pattern that isconnected to the first connecting portion; and a second wiring patternthat is connected to the second connecting portion; and the first wiringpattern may preferably be provided on a layer farther away from theplanar conductor than the second wiring pattern.

An electronic device according to a preferred embodiment of the presentinvention may preferably include an inductor bridge according to any oneof the preferred embodiments of the present invention described above;an antenna including an antenna element pattern that is electricallyconnected to the first connecting portion; and a metal member that isarranged on an opposite side of the antenna across the inductor bridge,and the inductor bridge may preferably include a first wiring patternthat is connected to the first connecting portion; and a second wiringpattern that is connected to the second connecting portion; and thefirst wiring pattern may preferably be provided on a layer farther awayfrom the metal member than the second wiring pattern.

An electronic device according to a preferred embodiment of the presentinvention may preferably include an inductor bridge according to any oneof the preferred embodiments of the present invention described above;and a planar conductor (such as a battery), and the inductor portion maypreferably include a conductor pattern of which the coil axis isoriented in a direction perpendicular or substantially perpendicular tothe principal surface of the element body and preferably has a spiralshape over a plurality of layers; and, among the conductor patterns, alayer on which the conductor pattern with the large number of turns isprovided may preferably be arranged on a layer spaced away from theplanar conductor.

An electronic device according to a preferred embodiment of the presentinvention may preferably include an inductor bridge according to any oneof the preferred embodiments of the present invention described above;and the inductor portion may preferably include a conductor pattern ofwhich the coil axis is oriented in a direction perpendicular orsubstantially perpendicular to the principal surface of the element bodyand preferably has a spiral shape over a plurality of layers; and theplurality of conductor patterns may preferably be provided in a positionof facing each other between the layers.

An electronic device according to a preferred embodiment of the presentinvention may preferably include an inductor bridge according to any oneof the preferred embodiments of the present invention described above;and a planar conductor (metal body), and the inductor portion maypreferably include a conductor pattern of which the coil axis isoriented in a direction perpendicular or substantially perpendicular tothe principal surface of the element body and preferably has a spiralshape over a plurality of layers; and the plurality of conductorpatterns may preferably be provided in a position in which a capacitanceis generated between the conductor pattern and the planar conductor.

The capacitance and the inductor portion may preferably define a lowpass filter.

According to various preferred embodiments of the present invention,since an inductor is provided in the circuit without mounting a chipinductor and a pattern inductor to a mounting circuit member such as asubstrate to be connected, an electronic device is downsized. Inaddition, since the number of processes in which the chip inductor ismounted to the mounting circuit member such as a substrate is reduced,cost reduction is achieved.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a perspective view showing an appearance of an inductorbridge according to a first preferred embodiment of the presentinvention, and FIG. 1B is an exploded perspective view of the inductorbridge.

FIG. 2A is a perspective view showing an appearance of another inductorbridge according to the first preferred embodiment of the presentinvention, and FIG. 2B is an exploded perspective view of the inductorbridge.

FIG. 3A is a plan view showing a state in which a mother substrate 201and an antenna substrate 301 are connected to each other using aninductor bridge 101B, and FIG. 3B is a cross sectional view taken online A-A of FIG. 3A.

FIG. 4A is a block diagram of a high frequency circuit equipped with theinductor bridge 101B and the antenna substrate 301, and FIG. 4B is anequivalent circuit diagram of the high frequency circuit.

FIG. 5 is a view showing an example of a structure of a portionconnecting the antenna substrate 301 and an inductor bridge 101C.

FIG. 6A is a block diagram showing one example of application of aninductor bridge, and FIG. 6B is an equivalent circuit diagram of theinductor bridge.

FIG. 7A is a perspective view showing an appearance of an inductorbridge 102, and FIG. 7B is an exploded perspective view of the inductorbridge.

FIG. 8 is a cross sectional view showing a state in which the mothersubstrate 201 and the antenna substrate 301 are connected to each otherby using the inductor bridge 102.

FIG. 9 is a view showing a state in which two substrates are connectedto each other with an inductor bridge.

FIG. 10A is a perspective view showing an appearance of an inductorbridge according to a second preferred embodiment of the presentinvention, and FIG. 10B is an exploded perspective view of the inductorbridge. FIG. 10C is a partial plan view showing a conductor pattern ofan inductor portion.

FIG. 11A is a perspective view showing an appearance of an inductorbridge according to a third preferred embodiment of the presentinvention, and FIG. 11B is an exploded perspective view of the inductorbridge.

FIG. 12A is a perspective view showing an appearance of an inductorbridge according to a fourth preferred embodiment of the presentinvention, and FIG. 12B is an exploded perspective view of the inductorbridge.

FIG. 13A is a perspective view showing an appearance of an inductorbridge according to a fifth preferred embodiment of the presentinvention, and FIG. 13B is an exploded perspective view of the inductorbridge.

FIG. 14A is a perspective view showing an appearance of an inductorbridge according to a sixth preferred embodiment of the presentinvention, and FIG. 14B is an exploded perspective view of the inductorbridge.

FIG. 15A is a perspective view showing an appearance of an inductorbridge according to a seventh preferred embodiment of the presentinvention, and FIG. 15B is an exploded perspective view of the inductorbridge.

FIG. 16A is a perspective view showing an appearance of another inductorbridge according to the seventh preferred embodiment of the presentinvention, and FIG. 16B is an exploded perspective view of the inductorbridge.

FIG. 17A is a perspective view showing an appearance of an inductorbridge according to an eighth preferred embodiment of the presentinvention, and FIG. 17B is an exploded perspective view of the inductorbridge.

FIG. 18 is a cross sectional view of an inductor portion of an inductorbridge 109.

FIG. 19 is a view showing a structure of an inside of a housing of anelectronic device 401 according to a ninth preferred embodiment of thepresent invention, that is, a plan view showing a state in which anupper housing 191 and a lower housing 192 are separated from each otherto expose the inside.

FIG. 20 is an exploded perspective view of an inductor bridge 110according to a tenth preferred embodiment of the present invention.

FIG. 21 is a cross sectional view of the inductor bridge 110, that is, across sectional view showing a dashed line portion in FIG. 20.

FIG. 22 is an equivalent circuit diagram of the inductor bridge 110.

FIG. 23 is a view showing a change in self-resonant frequency.

FIG. 24 is an exploded perspective view of an inductor bridge 111according to an eleventh preferred embodiment of the present invention.

FIG. 25 is a cross sectional view of the inductor bridge 111, that is, across sectional view showing a dashed line portion in FIG. 24.

FIG. 26 is an exploded perspective view of an inductor bridge 112according to a twelfth preferred embodiment of the present invention.

FIG. 27 is a cross sectional view of the inductor bridge 112, that is, across sectional view showing a dashed line portion in FIG. 26.

FIG. 28 is an equivalent circuit diagram of the inductor bridge 112.

FIG. 29A and FIG. 29B are perspective views of an inductor bridge 113according to a thirteenth preferred embodiment of the present invention.

FIG. 30 is a circuit diagram of a high frequency circuit equipped withan inductor bridge and an antenna according to a fourteenth preferredembodiment of the present invention.

FIG. 31 is a view showing a mounting (arranging) structure of theantenna ANT and the inductor bridge 114 shown in FIG. 30.

FIG. 32A and FIG. 32B are exploded perspective views showing a mountingstructure of the inductor bridge 114 shown in FIG. 31, and a positionalrelationship between the inductor bridge 114 and a metal pattern 83.

FIG. 33 is a view showing a structure of a high frequency circuitequipped with an inductor bridge 115 and an antenna substrate 301according to a fifteenth preferred embodiment of the present invention.

FIG. 34A and FIG. 34B are exploded perspective views showing a mountingstructure of the inductor bridge 115 shown in FIG. 33, and a positionalrelationship between the inductor bridge 115 and the antenna substrate301.

FIG. 35 is a view showing a structure of a high frequency circuitequipped with an inductor bridge 116, an antenna substrate 301, and amother substrate 201, according to a sixteenth preferred embodiment ofthe present invention.

FIG. 36A and FIG. 36B are exploded perspective views showing a mountingstructure of the inductor bridge 116 shown in FIG. 35, and a positionalrelationship between the inductor bridge 116 and the metal pattern 83 ofthe mother substrate 201.

FIG. 37 is a view showing a structure of a high frequency circuitequipped with an inductor bridge 117, an antenna substrate 301, and ametal member 84, according to a seventeenth preferred embodiment of thepresent invention.

FIG. 38A and FIG. 38B are exploded perspective views showing a mountingstructure of the inductor bridge 117 shown in FIG. 37, and a positionalrelationship between the inductor bridge 117 and the metal member 84.

FIG. 39A and FIG. 39B are exploded perspective views of inductor bridges118A and 118B according to an eighteenth preferred embodiment of thepresent invention.

FIG. 40 is a view showing a structure of a high frequency circuitequipped with an inductor bridge 119, an antenna substrate 301, and ametal member 84, according to a nineteenth preferred embodiment of thepresent invention.

FIG. 41A is a perspective view of the inductor bridge 119 shown in FIG.40, and FIG. 41B and FIG. 41C are exploded perspective views showing astructure of inductor bridges 119A and 119B, and a positionalrelationship between the inductor bridges 119A and 119B, and the metalmember 84.

FIG. 42 is a view showing a structure of a high frequency circuitequipped with an inductor bridge 120, an antenna substrate 301, and ametal member 84, according to a twentieth preferred embodiment of thepresent invention.

FIG. 43A is a perspective view of the inductor bridge 120, and FIG. 43Bis an exploded perspective view showing a structure of the inductorbridge 120, and a positional relationship between the inductor bridge120 and the metal member 84.

FIG. 44A is a cross sectional view of an element body 10 of the inductorbridge 120.

FIG. 44B is an equivalent circuit diagram of the inductor bridge 120.

FIG. 45A is a cross sectional view of an inductor bridge of which theinternal structure is slightly different from the internal structure ofthe inductor bridge 120, and FIG. 45B is an equivalent circuit diagramof the inductor bridge in that case.

FIG. 46 is a view showing a structure of a high frequency circuitequipped with an inductor bridge 121, an antenna substrate 301, a metalmember 84, and a mother substrate 201 according to a twenty-firstpreferred embodiment of the present invention.

FIG. 47 is a perspective view of the inductor bridge 121.

FIG. 48A and FIG. 48B are partially exploded perspective views of theinductor bridge 121 and views showing a bending position at which theinductor bridge 121 is bent.

FIG. 49A and FIG. 49B are other partially exploded perspective views ofthe inductor bridge 121 and views showing a bending position at whichthe inductor bridge 121 is bent.

FIG. 50A is a perspective view of an inductor bridge 123 according to atwenty-second preferred embodiment of the present invention, and FIG.50B is an exploded perspective view of the inductor bridge 123.

FIG. 51A is a perspective view of an inductor bridge 124 according to atwenty-third preferred embodiment of the present invention, and FIG. 51Bis an exploded perspective view of the inductor bridge 124.

FIG. 52A is a perspective view showing an appearance of an inductorbridge 125 according to a twenty-fourth preferred embodiment of thepresent invention.

FIG. 52B is an exploded plan view of the inductor bridge 125 accordingto the twenty-fourth preferred embodiment of the present invention.

FIG. 53A and FIG. 53B are views showing a part of a conductor patternnear a bending portion. FIG. 53C is a perspective view of the inductorbridge 125 in a state of being bent.

FIG. 54A is a plan view of the inductor bridge 125 and

FIG. 54B is a perspective view of the inductor bridge 125 in a state ofbeing bent.

FIG. 55A is a perspective view of an inductor bridge 126 according to atwenty-fifth preferred embodiment of the present invention, and FIG. 55Bis an exploded perspective view of the inductor bridge 126.

FIG. 56A is a perspective view showing a state in which an inductorportion of the inductor bridge 126 is bent from a portion other than theinductor portion. FIG. 56B and FIG. 56C are views showing a state inwhich the inductor bridge 126 is mounted to a mother substrate 201together with other components.

FIG. 57A is a perspective view of an inductor bridge 127 according to atwenty-sixth preferred embodiment of the present invention, and FIG. 57Bis an exploded perspective view of the inductor bridge 127.

FIG. 58A and FIG. 58B are views showing a state in which the inductorbridge 127 is mounted to a mother substrate 201 together with othercomponents.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, with reference to the attached drawings, several specificexamples will describe a plurality of preferred embodiments of thepresent invention. In the drawings, the components and elements assignedwith the same reference numerals or symbols will represent identicalcomponents and elements. Obviously, each of the preferred embodiments isillustrative and the configuration shown in different preferredembodiments is partially replaced and combined with each other.

First Preferred Embodiment

FIG. 1A is a perspective view showing the appearance of an inductorbridge according to a first preferred embodiment of the presentinvention, and FIG. 1B is an exploded perspective view of the inductorbridge. The inductor bridge 101A is an element configured tobridge-connect a first circuit and a second circuit. As shown in FIG.1A, the inductor bridge 101A is provided with a flexible flatplate-shaped element body 10, a first connector 51, and a secondconnector 52. The element body 10 includes therein an inductor portionto be described later. The first connector 51 is provided on a first endportion of the element body 10 and connected to the first circuit bymechanical contact. The second connector 52 is provided on a second endportion of the element body 10 and connected to the second circuit bymechanical contact. The first connector 51 is equivalent to the “firstconnecting portion” of a preferred embodiment of the present invention,and the second connector 52 is equivalent to the “second connectingportion” of a preferred embodiment of the present invention.

As shown in FIG. 1B, the element body 10 is configured by laminatingresin base materials 11, 12, and 13 of a liquid crystal polymer (LCP).The resin base material 12 includes an inductor portion 30 defined by aconductor pattern 31. The conductor pattern 31 is a spiral conductorpattern of which the coil axis is oriented in a direction perpendicularor substantially perpendicular to the face of the resin base material 12(direction perpendicular or substantially perpendicular to the principalsurface of the element body 10).

The resin base material 12 includes thereon wiring patterns 21 and 22,and the resin base material 13 includes thereon a wiring pattern 23. Thefirst end of the wiring pattern 21 is connected to the outer peripheralend of the conductor pattern 31 of the inductor portion, the innerperipheral end of the conductor pattern 31 is connected to the first endof the wiring pattern 23 through a via conductor (interlayer connectionconductor), and the second end of the wiring pattern 23 is connected tothe first end of the wiring pattern 22 through the via conductor.

The resin base material 11 includes thereon connector mountingelectrodes 41 and 42 to mount the connectors 51 and 52. These connectormounting electrodes 41 and 42 are connected to the second ends of thewiring patterns 21 and 22 through the via conductor, respectively.

The resin base material 11 includes a resist layer 61 on the uppersurface thereof, and the resin base material 13 includes a resist layer62 on the lower surface thereof. It is to be noted that the resist layer62 is not essential and is not necessary to be provided.

A non-limiting example of a method of manufacturing the inductor bridge101A is as follows.

(1) To begin with, a resin base material and a metal foil (copper foil,for example) are laminated and the metal foil is patterned byphotolithography to form wiring patterns 21, 22, and 23, a conductorpattern 31, and connector mounting electrodes 41 and 42. In addition,the resin base materials 11 and 12 include a via conductor. The viaconductor is mounted by arranging conductive paste including copper,silver, and tin after providing a through hole by laser or the like, andcuring the paste in the following heating and pressurizing process.

(2) The resin base materials 11, 12, and 13 are laminated, heated, andpressurized to configure a laminate (aggregate substrate).

(3) The resist layers 61 and 62 are printed on the opposite surfaces ofthe laminate, respectively.

(4) The connectors 51 and 52 are soldered.

(5) The aggregate substrate is divided to obtain an individual inductorbridge 101A.

FIG. 2A is a perspective view showing the appearance of another inductorbridge according to the first preferred embodiment of the presentinvention, and FIG. 2B is an exploded perspective view of the inductorbridge. The inductor bridge 101B includes the first connector 51 and thesecond connector 52 that are mounted on different surfaces with respectto the element body 10.

As shown in FIG. 2B, the connector mounting electrode 42 is formed onthe lower surface of the resin base material 13. The resist layers 61and 62 are provided in a pattern corresponding to the positions of theconnector mounting electrodes 41 and 42. Other configurations arepreferably the same as the configurations of the examples shown in FIG.1A and FIG. 1B.

FIG. 3A is a plan view showing a state in which a mother substrate 201and an antenna substrate 301 are connected to each other using theinductor bridge 101B, and FIG. 3B is a cross sectional view taken online A-A of FIG. 3A.

The antenna substrate 301 includes thereon an antenna element pattern91. The antenna element pattern 91 includes a feed point, and the firstconnector 51 of the inductor bridge 101B is connected to the feed pointor a portion drawn out from the feed point. The second connector 52 ofthe inductor bridge 101B is connected to a connecting portion providedon the upper surface of the mother substrate 201.

FIG. 4A is a block diagram of a high frequency circuit equipped with theinductor bridge 101B and the antenna substrate 301, and FIG. 4B is anequivalent circuit diagram of the high frequency circuit. The inductorbridge 101B includes an inductor L1. As shown in FIG. 4A, the inductorL1 is connected between an antenna ANT and an RFIC. In other words, asshown in FIG. 4B, the inductor L1 is inserted in series in a feedingportion of the antenna element pattern 91. The inductor L1 performsimpedance matching between a feed circuit (RFIC) and the antenna, andthe frequency characteristics of the antenna.

FIG. 5 is a view showing an example of a structure of a portionconnecting the antenna substrate 301 and an inductor bridge 101C. Theconfigurations other than the connector of the inductor bridge 101C arepreferably the same as the configurations of the inductor bridges 101Aand 101B that have already been shown. The feed point of the antennaelement pattern 91 includes a hole H1.

The inductor bridge 101C includes a first end portion that includes anelectrode (first connecting portion) and a hole H3. Screwing a screwinto the hole H1 through the hole H3 on the side of the inductor bridgemakes mechanical and electrical connections.

FIG. 6A is a block diagram showing another example of application of theinductor bridge, and FIG. 6B is an equivalent circuit diagram of theinductor bridge. This example shows an example of an antenna configuredby inserting an inductor between a ground connection point in aninverted F-shaped antenna and the ground.

In FIG. 6A and FIG. 6B, the inductor bridge 102 includes an inductor L2.The inductor L2 is connected between the antenna ANT and the ground todefine the inverted F-shaped antenna. Specifically, as shown in FIG. 6B,the inductor L2 is connected between the end of the antenna elementpattern 91, and the ground, and the feed circuit (RFIC) is connectednear the inductor L2 of the antenna element pattern 91.

FIG. 7A is a perspective view showing the appearance of an inductorbridge 102, and FIG. 7B is an exploded perspective view of the inductorbridge 102. The inductor bridge 102 includes the first connector 51 andthe second connector 52 that are mounted on different surfaces withrespect to the element body 10.

As shown in FIG. 7B, the connector mounting electrode 42 is provided onthe lower surface of the resin base material 13. The resist layers 61and 62 are provided in a pattern corresponding to the positions of theconnector mounting electrodes 41 and 42. The resin base material 12includes an inductor portion 30 defined by a conductor pattern 31.

The resin base material 12 includes thereon a wiring pattern 21, and aresin base material 13 includes thereon a wiring pattern 23. The firstend of the wiring pattern 21 is connected to the outer peripheral end ofthe conductor pattern 31 of the inductor portion, and the innerperipheral end of the conductor pattern 31 is connected to the first endof the wiring pattern 23 through the via conductor (interlayerconnection conductor).

The resin base materials 11 and 13 include thereon the connectormounting electrodes 41 and 42 to mount the connectors 51 and 52. Theseconnector mounting electrodes 41 and 42 are connected to the second endsof the wiring patterns 21 and 23 through the via conductor,respectively. Other configurations are preferably the same as theconfigurations of the examples shown in FIG. 1A and FIG. 1B.

FIG. 8 is a cross sectional view showing a state in which the mothersubstrate 201 and the antenna substrate 301 are connected to each otherusing the inductor bridge 102.

The antenna substrate 301 includes thereon an antenna element pattern91. The antenna element pattern 91 includes an end portion, and thefirst connector 51 of the inductor bridge 102 is connected to the endportion or a part drawn out from the end portion. The second connector52 of the inductor bridge 102 is connected to a connecting portionformed on the upper surface of the mother substrate 201. The connectingportion on the mother substrate 201 is electrically connected to aground conductor pattern GND expanding two-dimensionally.

Between the antenna substrate 301 and the mother substrate 201, themother substrate 201 includes a surface mounting component 160 withrespect to the mother substrate 201.

The inductor portion 30 of the inductor bridge 102 is provided at aposition close to the second connector 52 connected to the ground. Inother words, the inductor portion 30 is provided away from the antennasubstrate 301. This significantly reduces or prevents degradation of theantenna characteristics due to the electromagnetic radiation in theinductor portion 30. In addition, the wiring pattern 21 close to theantenna of the inductor bridge is caused to act as a part of theantenna.

Moreover, as shown in FIG. 8, if the inductor portion 30 of the inductorbridge 102 extends in a direction perpendicular or substantiallyperpendicular to the mother substrate 201, the coil axis A of theinductor portion 30 is parallel or substantially parallel to the mothersubstrate 201. Therefore, the inductor portion 30 is difficult to beaffected by the ground conductor pattern GND provided in the mothersubstrate 201. Specifically, the configuration significantly reduces orprevents undesired coupling between the inductor portion 30 and theground conductor GND and significantly reduces an eddy current generatedin the ground conductor GND. The coil axis A of the inductor portion 30may not necessarily be completely parallel to the mother substrate 201,and, unless the coil axis A is at least perpendicular or substantiallyperpendicular to the mother substrate 201, the effects is achieved to aconsiderable extent according to the angle.

It should be noted that, other than the inductor bridge 102 as shown inFIG. 7A and FIG. 7B, other inductor bridges such as the inductor bridge101B as shown in FIG. 2A and FIG. 2B is applied to configure theinductor portion of the inverted F-shaped antenna.

FIG. 9 is a view showing a state in which two substrates are connectedto each other with an inductor bridge. A substrate 302 includes anelectronic component such as an IC. The inductor bridge 101D includes afirst connecting portion that is connected to the upper surface of thesubstrate 302, and a second connecting portion that is connected to theupper surface of the mother substrate 202.

The configuration other than the connector of the inductor bridge 101Dis the same as the configuration of the inductor bridge 101A that hasalready been shown.

A description with reference to the drawings in each preferredembodiment to be shown later will be given of only a portion of theconfiguration that is different from the configuration of the inductorbridge shown in the first preferred embodiment of the present invention.Therefore, the configuration of the inductor bridges 103 to 107, 108A,108B, and 109 to be described below and the configuration of theinductor bridges 101B to 101D, and 102 is combined or replaced to beimplemented.

Second Preferred Embodiment

FIG. 10A is a perspective view showing the appearance of an inductorbridge according to a second preferred embodiment of the presentinvention, and FIG. 10B is an exploded perspective view of the inductorbridge. The inductor bridge 103 is provided with a flexible flatplate-shaped element body 10, a first connector 51, and a secondconnector 52. As shown in FIG. 10B, the element body 10 is configured bylaminating resin base materials 11, 12, 13, and 14. The resin basematerials 12 and 13 include an inductor portion defined by spiralconductor patterns 31 and 32. The spiral conductor patterns 31 and 32are spiral conductor patterns of which the coil axis is oriented in adirection perpendicular or substantially perpendicular to the faces ofthe resin base materials 12 and 13 (direction perpendicular orsubstantially perpendicular to the principal surface of the element body10).

The resin base material 12 includes thereon wiring patterns 21 and 22,and the resin base material 14 includes thereon a wiring pattern 23. Thefirst end of the wiring pattern 21 is connected to the outer peripheralend of the conductor pattern 31 of the inductor portion, the innerperipheral end of the conductor pattern 31 is connected to the outerperipheral end of the conductor pattern 32 through the via conductor(interlayer connection conductor), and the inner peripheral end of theconductor pattern 32 is connected to the first end of the wiring pattern23, and the second end of the wiring pattern 23 is connected to thefirst end of the wiring pattern 22 through the via conductor. Theconductor patterns 31 and 32 are arranged so as not to be continuouslyoverlapped in a plan view. FIG. 10C is a partial plan view showing theconductor pattern of the inductor portion. Other configurations arepreferably the same as the configurations shown in FIG. 1B.

In such a configuration, with a slight increase in stray capacitance forthe increase in inductance accompanying the increase in the number oflayers, the inductor bridge is used as an inductor up to a higherfrequency band.

Third Preferred Embodiment

FIG. 11A is a perspective view showing the appearance of an inductorbridge according to a third preferred embodiment of the presentinvention, and FIG. 11B is an exploded perspective view of the inductorbridge. The inductor bridge 104 is provided with a flexible flatplate-shaped element body 10, a first connector 51, and a secondconnector 52. As shown in FIG. 11B, the element body 10 is configured bylaminating resin base materials 11, 12, 13, and 14. The resin basematerials 12 and 13 include an inductor portion defined by spiralconductor patterns 31 and 32. The spiral conductor patterns 31 and 32are spiral conductor patterns of which the coil axis is oriented in adirection perpendicular or substantially perpendicular to the faces ofthe resin base materials 12 and 13 (direction perpendicular orsubstantially perpendicular to the principal surface of the element body10).

The resin base material 12 includes thereon wiring patterns 21 and 22,and the resin base material 14 includes thereon a wiring pattern 23. Thefirst end of the wiring pattern 21 is connected to the outer peripheralend of the conductor pattern 31 of the inductor portion, the innerperipheral end of the conductor pattern 31 is connected to the outerperipheral end of the conductor pattern 32 through the via conductor(interlayer connection conductor), and the inner peripheral end of theconductor pattern 32 is connected to the first end of the wiring pattern23, and the second end of the wiring pattern 23 is connected to thefirst end of the wiring pattern 22 through the via conductor. The outerperipheral ends as well as the inner peripheral ends of the conductorpatterns 31 and 32 are connected to each other. In other words, theconductor patterns 31 and 32 are connected in parallel to each other.Other configurations are preferably the same as the configurations shownin FIG. 1B.

With such a configuration, an inductor bridge equipped with an inductorwith a low equivalent series resistance is obtained.

Fourth Preferred Embodiment

FIG. 12A is a perspective view showing the appearance of an inductorbridge according to a fourth preferred embodiment of the presentinvention, and FIG. 12B is an exploded perspective view of the inductorbridge. The inductor bridge 105 is provided with a flexible flatplate-shaped element body 10, a first connector 51, and a secondconnector 52. As shown in FIG. 12B, the element body 10 is configuredpreferably by laminating resin base materials 11 and 12. The resin basematerial 12 includes an inductor portion defined by a meanderline-shaped conductor pattern 31 extending in the shorter direction ofthe element body.

The resin base material 12 includes thereon wiring patterns 21 and 22.The first end of the wiring pattern 21 is connected to the first end ofthe conductor pattern 31 of the inductor portion, the second end of theconductor pattern 31 is connected to the first end of the wiring pattern22, and the second ends of the wiring patterns 21 and 22 are connectedto the connector mounting electrodes 41 and 42 through the viaconductor. Other configurations are preferably the same as theconfigurations shown in FIG. 1B.

In FIG. 12A and FIG. 12B, the dashed line indicates a bending position(approximate position). A bending portion is located near the boundarybetween the position of the inductor portion and the position other thanthe inductor portion. Since the inductor portion defined by the meanderline-shaped conductor pattern 31 has a high rigidity in the longerdirection, bending at the position other than the position of theinductor portion becomes easy. Furthermore, with such a configuration,change in inductance by the bending of the element body 10 issignificantly reduced or prevented.

It is to be noted that an inductor portion defined by the meanderline-shaped conductor pattern of which the lines that are adjacent toeach other each extend in the shorter direction of the element body,unlike the conductor pattern of the inductor portion described in thefourth preferred embodiment, enhances the flexibility of the elementbody in the longer direction. In addition, the amount of the change ininductance with respect to the amount of the bending of the element bodyis significantly reduced or prevented.

Fifth Preferred Embodiment

FIG. 13A is a perspective view showing the appearance of an inductorbridge according to a fifth preferred embodiment of the presentinvention, and FIG. 13B is an exploded perspective view of the inductorbridge. The inductor bridge 106 is provided with a flexible flatplate-shaped element body 10, a first connector 51, and a secondconnector 52. As shown in FIG. 13B, the element body 10 is preferablyconfigured by laminating resin base materials 11 and 12. The resin basematerials 11 and 12 include thereon a helical conductor pattern 31 ofwhich the coil axis is oriented in a direction in parallel orsubstantially parallel to the principal surface of the element body 10.

The resin base material 11 includes thereon wiring patterns 21 and 22.The first end of the wiring pattern 21 is connected to the first end ofthe conductor pattern 31 of the inductor portion, the second end of theconductor pattern 31 is connected to the first end of the wiring pattern22, and the second ends of the wiring patterns 21 and 22 are connectedto the connector mounting electrodes 41 and 42. Other configurations arepreferably the same as the configurations shown in FIG. 1B.

Thus, the helical conductor pattern 31 of which the coil axis isoriented in a direction in parallel or substantially parallel to theprincipal surface of the element body 10, even if the inductor bridge106 is adjacent to a conductor, makes it difficult to generate an eddycurrent in the conductor and significantly reduces the change ininductance by the surrounding environment.

Sixth Preferred Embodiment

FIG. 14A is a perspective view showing the appearance of an inductorbridge according to a sixth preferred embodiment of the presentinvention, and FIG. 14B is an exploded perspective view of the inductorbridge. The inductor bridge 107 is provided with a flexible flatplate-shaped element body 10, a first connector 51, and a secondconnector 52. As shown in FIG. 14B, the element body 10 is configured bylaminating resin base materials 11, 12, 13, and 14. The resin basematerials 12 and 13 include thereon helical conductor patterns 31 and 32each of which the coil axis is oriented in a direction perpendicular orsubstantially perpendicular to the principal surface of the element body10. The resin base material 12 includes an aperture AP, which storestherein a magnetic body core 70 of a ferrite plate. Specifically, themagnetic body core 70 is embedded in the element body 10. Otherconfigurations are preferably the same as the configurations shown inFIG. 1B and FIG. 10B.

Thus, the arrangement of the magnetic body core 70 near the conductorpattern of the inductor portion reduces the size of the inductor portionand thus achieves a small inductor bridge.

Seventh Preferred Embodiment

FIG. 15A is a perspective view showing the appearance of an inductorbridge according to a seventh preferred embodiment of the presentinvention, and FIG. 15B is an exploded perspective view of the inductorbridge. The inductor bridge 108A is provided with a flexible flatplate-shaped element body 10, a first connector 51, and a secondconnector 52. The resin base material includes an inductor portiondefined by a spiral conductor pattern 31. The resin base material 12includes thereon a wiring pattern 21, and the resin base material 13includes thereon a wiring pattern 22. The first end of the wiringpattern 21 is connected to the outer peripheral end of the conductorpattern 31 of the inductor portion, and the inner peripheral end of theconductor pattern 31 is connected to the first end of the wiring pattern22 through the via conductor. The resin base material 11 includesthereon connector mounting electrodes 41 and 42 to mount the connectors51 and 52. These connector mounting electrodes 41 and 42 are connectedto the second ends of the wiring patterns 21 and 22 through the viaconductor, respectively.

The resin base materials 11 and 14 include thereon shield conductorpatterns 81 and 82. In this way, the shield conductor patterns 81 and 82provided at a position of interposing the inductor portion the shieldconductor in a laminating direction electromagnetically shield theinductor portion, which achieves stable characteristics.

It should be noted that the connectors 51 and 52 are coaxial typeconnectors and include a central conductor that is connected to theconnector mounting electrodes 41 and 42, and an outer conductor that isconnected to the shield conductor pattern 81.

FIG. 16A is a perspective view showing the appearance of anotherinductor bridge 108B according to the seventh preferred embodiment ofthe present invention, and FIG. 16B is an exploded perspective view ofthe inductor bridge 108B. The shield conductor patterns 81 and 82provided in the resin base materials 11 and 14 each include an apertureAP. Other configurations are preferably the same as the configuration ofthe inductor bridge 108A as shown in FIG. 15A and FIG. 15B. Thus, evenif the shield conductor pattern does not continuously expand entirely,the electromagnetic shield effect is obtained. A plurality of aperturesAP may be configured to provide a mesh-shaped shield conductor pattern.In addition, the arrangement of the aperture AP at the positioncorresponding to the inductor portion also equalizes the rigidity of theelement body 10.

Eighth Preferred Embodiment

FIG. 17A is a perspective view showing the appearance of an inductorbridge according to an eighth preferred embodiment of the presentinvention, and FIG. 17B is an exploded perspective view of the inductorbridge. In addition, FIG. 18 is a cross sectional view of an inductorportion of an inductor bridge 109. The inductor bridge 109 is providedwith a flexible flat plate-shaped element body 10, a first connector 51,and a second connector 52. The resin base material 13 includes aninductor portion defined by a chip conductor 39. The resin base material12 includes an aperture AP in which the chip inductor 39 is stored. Theresin base material 13 includes wiring patterns 21 and 22 to which thechip inductor 39 is connected, on the lower surface of the resin basematerial 13, and the resin base material 11 includes connector mountingelectrodes 41 and 42 to mount the connectors 51 and 52, on the uppersurface of the resin base material 11. These connector mountingelectrodes 41 and 42 are connected to the wiring patterns 21 and 22through the via conductor, respectively.

In this way, the arrangement of the chip inductor 39 in the center ofthe element body 10 in both the planar direction and the thicknessdirection of the element body 10 makes it possible to decrease stressapplied to the chip inductor 39 by the bending of the element body 10and to use the inductor bridge while the flexibility of the element body10 is maintained. Moreover, the inductor bridge is used as an inductorbridge having a constant thickness.

Ninth Preferred Embodiment

FIG. 19 is a view showing a structure of an inside of a housing of anelectronic device 401 according to a ninth preferred embodiment of thepresent invention, that is, a plan view showing a state in which anupper housing 191 and a lower housing 192 are separated from each otherto expose the inside. The electronic device 401 is, for example, aportable telephone terminal or a tablet PC, that is, a device providedwith the inductor bridge 101A as shown in FIG. 1A and FIG. 1B.

The upper housing 191 stores therein printed wiring boards 171 and 181,a battery pack 183, and the like. The printed wiring board 171 alsoincludes a UHF band antenna 172, a camera module 176, and the like.Similarly, the printed wiring board 181 includes a UHF band antenna 182.The printed wiring board 171 and the printed wiring board 181 areconnected to each other through a cable 184.

The printed wiring board 181 and the antenna 182 are connected to eachother through the inductor bridge 101A. The configuration of theinductor bridge 101A is as shown in FIG. 1A and FIG. 1B.

It is to be noted that the inductor bridge may be used in place of thecable 184 that connects the printed wiring boards 171 and 181.

Tenth Preferred Embodiment

FIG. 20 is an exploded perspective view of an inductor bridge 110according to a tenth preferred embodiment of the present invention. Theinductor bridge 110 is provided with a flexible flat plate-shapedelement body, a first connector 51, and a second connector 52. Theelement body is configured by laminating resin base materials 11, 12,13, and 14.

FIG. 21 is a cross sectional view of the inductor bridge 110, that is, across sectional view showing a dashed line portion in FIG. 20.

The resin base materials 11 to 14 include an inductor portion defined byconductor patterns 31 to 34. The conductor patterns 31 to 34 preferablyare rectangular or substantially rectangular helical conductor patternseach of which the coil axis is oriented in a direction perpendicular orsubstantially perpendicular to the face of the resin base materials 11to 14 (direction perpendicular or substantially perpendicular to theprincipal surface of the element body). The end of the conductor pattern31 is connected to the first end of the wiring pattern 21, and the endof the conductor pattern 34 is connected to the first end of the wiringpattern 23.

The resin base material 11 includes thereon connector mountingelectrodes 41 and 42 to mount the connectors 51 and 52. The connectormounting electrode 41 is connected to the second end of the wiringpattern 21, and the connector mounting electrode 42 is connected to thesecond end of the wiring pattern 23 through the via conductor.

The conductor patterns 31 to 34 are provided at positions of facing eachother between layers. Specifically, the plurality of conductor patterns31 to 34, when being viewed in a plan view in a laminating direction,are overlapped with each other. Of the plurality of conductor patterns,a line width of the conductor pattern 31 that is close to the firstconnector 51 (first connecting portion) on a path and a line width ofthe conductor pattern 34 that is close to the second connector 52(second connecting portion) on a path are thinner than the line widthsof the conductor patterns 32 and 33 of the other layers.

As shown in FIG. 21, since the conductor patterns 31 to 34 are providedat the positions of facing each other between the layers, capacitanceC1, C2, and C3 is generated between the conductor patterns that areadjacent to each other in the laminating direction. The line widths ofthe conductor patterns and 34 are thinner than the line widths of theconductor patterns 32 and 33, and, since the conductor patterns 32 and33 are interposed between the conductor pattern 31 and the conductorpattern 34, capacitance C0 to be generated between the conductor pattern31 and the conductor pattern 34 is small. In addition, the capacitancesatisfies a relationship of C1<C2 and C3<C2.

FIG. 22 is an equivalent circuit diagram of the inductor bridge 110. Asshown in FIG. 22, inductors L1, L2, L3, and L4 are equivalent to theinductance components of the conductor patterns 31, 32, 33, and 34,capacitors C1, C2, and C3, as shown in FIG. 21, are equivalent tocapacitance components generated between the layers among the conductorpatterns 31 to 34, and the capacitor C0 is equivalent to a capacitancecomponent generated between the conductor pattern 31 and the conductorpattern 34. It should be noted that the resistance component of theconductor pattern is omitted in the drawing.

While the self-resonant frequency of the inductor bridge 110 isdetermined by the inductance components mainly indicated as theinductors L1 to L4 and the capacitance components mainly indicated asthe capacitors C0 to C3, of the capacitance generated in each portion,the capacitance of the capacitor C0 to which a large voltage is applied(of which the potential difference between the conductor patterns islarge) predominantly determines a self-resonant frequency. According topreferred embodiments of the present invention, since C0 is effectivelyreduced or prevented, as described above, the self-resonant frequency isincreased.

FIG. 23 is a view showing a change in self-resonant frequency. When theline widths of the conductor patterns 31 to 34 as shown in FIG. 20 andFIG. 21 are equal or substantially equal to each other, theself-resonant frequency is a frequency as indicated by f0. According tothe present preferred embodiment of the present invention, the linewidths of the conductor patterns and 34 are thinner than the line widthsof the conductor patterns 32 and 33, so that the self-resonant frequencybecomes higher, as indicated by f1. On the condition that the linewidths of the conductor patterns 31 and 34 are thicker than the linewidths of conductor patterns 32 and 33, the self-resonant frequencybecomes lower, as indicated by f2. According to the present preferredembodiment of the present invention, the line widths of the conductorpatterns 31 and 34 are thinner than the line widths of the conductorpatterns 32 and 33, so that the self-resonant frequency becomes higherand the pass band width PB is wider.

It is to be noted that even if the line widths of the conductor patterns31 and 34 are thinner, the line widths of the other conductor patterns32 and 33 is thicker, the increase in direct current resistance (DCR) inthe inductor portion is significantly reduced or prevented.

Eleventh Preferred Embodiment

FIG. 24 is an exploded perspective view of an inductor bridge 111according to an eleventh preferred embodiment of the present invention.The inductor bridge 111 is provided with a flexible flat plate-shapedelement body, a first connector 51, and a second connector 52. Theelement body is configured by laminating resin base materials 11, 12,13, and 14.

FIG. 25 is a cross sectional view of the inductor bridge 111, that is, across sectional view showing a dashed line portion in FIG. 24.

The inductor bridge 111 is different in thickness of the conductorpatterns 31 and 34 from the inductor bridge as shown in FIG. 20 and FIG.21. According to the present preferred embodiment of the presentinvention, as the line widths of the conductor patterns 31 and 34 arethinner, the conductor thickness of the conductor patterns 31 and 34 arethicker, which prevents direct current resistance (DCR) from increasing.With the configuration, even if the line widths of the conductorpatterns 31 and 34 are thinner, the DCR is significantly reduced so asto be quite low.

Twelfth Preferred Embodiment

FIG. 26 is an exploded perspective view of an inductor bridge 112according to a twelfth preferred embodiment of the present invention.The inductor bridge 112 is provided with a flexible flat plate-shapedelement body, a first connector 51, and a second connector 52. Theelement body is configured by laminating resin base materials 11, 12,13, and 14.

FIG. 27 is a cross sectional view of the inductor bridge 112, that is, across sectional view showing a dashed line portion in FIG. 26.

In the present preferred embodiment of the present invention, while theline widths of the conductor patterns 31 to 34 of the inductor portionare equal or substantially equal to each other, the distances betweenthe layers of the conductor patterns 31 to 34 of the inductor portionare not equal to each other. In other words, the distance between theconductor pattern 31 and the conductor pattern 32 is larger than thedistance between the conductor pattern 32 and the conductor pattern 33.Similarly, the distance between the conductor pattern 33 and theconductor pattern 34 is larger than the distance between the conductorpattern 32 and the conductor pattern 33.

FIG. 28 is an equivalent circuit diagram of the inductor bridge 112. InFIG. 28, an inductor La and a resistance Ra are equivalent to theinductance component and the resistance component of the conductorpatterns 31 and 32. Similarly, an inductor Lb and a resistance Rb areequivalent to the inductance component and the resistance component ofthe conductor patterns 32 and 33, and an inductor Lc and a resistance Rcare equivalent to the inductance component and the resistance componentof the conductor patterns 33 and 34. A mutual inductance M is generatedbetween the inductors La and Lb and between the inductors Lb and Lc,respectively. In addition, a capacitor Ca is equivalent to a capacitancecomponent that is generated between the conductor patterns 31 and 32.Similarly, a capacitor Cb is equivalent to a capacitance component thatis generated between the conductor pattern 32 and the conductor pattern33, and a capacitor Cc is equivalent to a capacitance component that isgenerated between the conductor pattern 33 and the conductor pattern 34.

Since the distance between the conductor pattern 31 and the conductorpattern 32 and the distance between the conductor pattern 33 and theconductor pattern 34 are larger than the distance between the conductorpattern 32 and the conductor pattern 33, the capacitance Ca, Cb, and Ccsatisfies a relationship of (Ca, Cc)<Cb.

The simulation of the above described configuration has revealed that,compared to a case in which the distances between the layers of theconductor patterns 31 to 34 are equal or substantially equal to eachother, the self-resonant frequency increases. Thus, among the pluralityof conductor patterns, the distance between the conductor patterns 31and 34 close to the first connector 51 and the second connector 52 on apath and between the conductor patterns of adjacent layers that areadjacent to the conductor patterns 31 and 34 is larger than the distancebetween the conductor patterns of other adjacent layers, so that thepass band width of the inductor bridge is wider.

It should be noted that while, in the tenth preferred embodiment, theeleventh preferred embodiment, and the twelfth preferred embodiment ofthe present invention, the conductor pattern that defines the inductorportion preferably is four-layered, the conductor pattern may also bethree-layered, or five or more-layered, for example.

Thirteenth Preferred Embodiment

FIG. 29A and FIG. 29B are perspective views of an inductor bridge 113according to a thirteenth preferred embodiment of the present invention.FIG. 29A is a perspective view in which the upper surface is viewed, andFIG. 29B is a perspective view in which the lower surface is viewed. Theresin base material 11 includes a spiral conductor pattern 31 and wiringpatterns 21 and 22 on the upper surface of the resin base material 11and includes a wiring pattern 23 on the lower surface of the resin basematerial 11. The first end of the wiring pattern 23 is connected to theinner peripheral end of the spiral conductor pattern 31 through the viaconductor, and the second end of the wiring pattern 23 is connected tothe end portion of the wiring pattern 22 through the via conductor.

While, in the example shown in FIG. 1A and FIG. 1B, the conductorpattern 31 and the wiring patterns 21 and 22 are provided on two resinbase materials, like the example shown in FIG. 29A and FIG. 29B, variousconductor patterns may be provided on the one-layer resin base material11. The outermost surface includes thereon a resist layer to protect theconductor patterns, as needed.

According to the present preferred embodiment of the present invention,a substrate of which the opposite surfaces are coated with a metal foilis used and defined by one layer, which eliminates the laminating stepand the press-bonding step, that is, simplifies the processing steps.

Fourteenth Preferred Embodiment

FIG. 30 is a circuit diagram of a high frequency circuit equipped withan inductor bridge and an antenna according to a fourteenth preferredembodiment of the present invention. In this example, an inductor bridge114 is used as the inductor L1 provided in the feed line of the antennaANT.

FIG. 31 is a view showing a mounting (arranging) structure of theantenna ANT and the inductor bridge 114 shown in FIG. 30.

The antenna substrate 301 includes thereon an antenna element pattern.The first connector 51 of the inductor bridge 114 is connected to apredetermined position of the antenna element pattern. The secondconnector 52 of the inductor bridge 114 is connected to a connectingportion provided on the upper surface of the mother substrate 201.

The mother substrate 201 that is close to the inductor bridge 114includes thereon a metal pattern (such as a ground conductor pattern anda wiring pattern connected to an RFIC) 83. The metal pattern 83 isconnected to a predetermined position of the antenna element pattern ofthe antenna substrate 301.

In FIG. 31, since a potential difference is likely to occur between thewiring pattern between the inductor portion 30 of the inductor bridge114 and the second connector 52, and the metal pattern 83 (regionindicated as A in FIG. 31), the parasitic capacitance generated in theregion is preferably be small.

FIG. 32A and FIG. 32B are exploded perspective views showing themounting structure of the inductor bridge 114 shown in FIG. 31, and apositional relationship between the inductor bridge 114 and the metalpattern 83. In FIG. 32A and FIG. 32B, since the structures of theinductor bridges are different from each other, different referencenumerals 114A and 114B are used to identify the inductor bridges,respectively.

In the both structures shown in FIG. 32A and FIG. 32B, the resin basematerials 11, 12, and 13 include thereon a spiral conductor pattern 31,wiring patterns 21 and 22, and connector mounting electrodes 41 and 42.

In the example shown in FIG. 32B, in the inductor bridge 114B, thewiring pattern 22 on the side of the second connector 52 to which anRFIC is connected is provided on a layer closer to the metal pattern 83(planar conductor) than the wiring pattern 21 on the side of the firstconnector 51. The connector mounting electrode 41 and the metal pattern83 have the same electric potential, and the parasitic capacitancegenerated between the wiring pattern 22 and the metal pattern 83 islarge. Therefore, the influence on the antenna characteristics iscomparatively large.

In contrast, in the example shown in FIG. 32A, in the inductor bridge114A, the resin base material 11 includes thereon a spiral conductorpattern 31, a wiring pattern 22, and a connector mounting electrode 41.The resin base material 12 includes thereon a wiring pattern 21. Theresin base material 13 includes thereon a connector mounting electrode42.

According to the mounting structure of the inductor bridge shown in FIG.32A, the wiring pattern 22 on the side of the second connector 52 towhich an RFIC is connected and the conductor pattern 31 of the inductorportion 30 are provided on a layer farther away from the metal pattern83 (planar conductor) than the wiring pattern 21 on the side of thefirst connector 51. Therefore, the parasitic capacitance generatedbetween the wiring pattern 22 and the conductor pattern 31, and themetal pattern 83 is small, and the influence on the antennacharacteristics is small.

Fifteenth Preferred Embodiment

FIG. 33 is a view showing a structure of a high frequency circuitequipped with an inductor bridge 115 and an antenna substrate 301according to a fifteenth preferred embodiment of the present invention.In this example, the inductor bridge 115 is preferably used as the feedline of the antenna. In FIG. 33, since the potential difference is largebetween the conductor pattern connected to the second connector 52 awayfrom the first connector connected to the antenna substrate 301, and theantenna substrate 301 (region indicated as A in FIG. 33), the parasiticcapacitance generated in the portion is preferably small.

FIG. 34A and FIG. 34B are exploded perspective views showing a mountingstructure of the inductor bridge 115 shown in FIG. 33, and a positionalrelationship between the inductor bridge 115 and the antenna substrate301. In FIG. 34A and FIG. 34B, since the structures of the inductorbridges are different from each other, different reference numerals 115Aand 115B are used to identify the inductor bridges, respectively.

In the both structures shown in FIG. 34A and FIG. 34B, the resin basematerials 11, 12, and 13 include thereon a spiral conductor pattern 31,wiring patterns 21 and 22, and connector mounting electrodes 41 and 42.The first connector 51 is connected to the end portion of the antennaelement pattern 91 of the antenna substrate.

In the example shown in FIG. 34B, in the inductor bridge 115B, thewiring pattern 22 on the side of the second connector 52 that faces thevicinity of the open end of the antenna element pattern 91 is providedon a layer closer to the antenna element pattern 91 than the wiringpattern 21 on the side of the first connector 51. Therefore, theparasitic capacitance generated between the wiring pattern 22 and theantenna element pattern 91 is large, and the influence on the antennacharacteristics is comparatively large.

In contrast, in the example shown in FIG. 34A, in the inductor bridge115A, the wiring pattern 22 on the side of the second connector 52 thatfaces the vicinity of the open end of the antenna element pattern 91 islocated on a layer farther away from the antenna element pattern 91 thanthe wiring pattern 21 on the side of the first connector 51. Therefore,the parasitic capacitance generated between the wiring pattern 22 andthe antenna element pattern 91 is small, and the influence on theantenna characteristics is small.

Sixteenth Preferred Embodiment

FIG. 35 is a view showing a structure of a high frequency circuitequipped with an inductor bridge 116, the antenna substrate 301, and themother substrate 201, according to a sixteenth preferred embodiment ofthe present invention. In this example, the inductor bridge 116 ispreferably used as the feed line of the antenna. In FIG. 35, since thesecond connector 52 is connected to the metal pattern 83 and thepotential difference is large between the conductor pattern connected tothe first connector 51 connected to the antenna substrate 301, and themetal pattern 83 of the mother substrate 201 (region indicated as A inFIG. 35), the parasitic capacitance generated in the portion ispreferably small.

FIG. 36A and FIG. 36B are exploded perspective views showing a mountingstructure of the inductor bridge 116 shown in FIG. 35, and a positionalrelationship between the inductor bridge 116 and the metal pattern 83 ofthe mother substrate 201. In FIG. 36A and FIG. 36B, since the structuresof the inductor bridges are different from each other, differentreference numerals 116A and 116B are used to identify the inductorbridges, respectively.

In the both structures shown in FIG. 36A and FIG. 36B, the resin basematerials 11, 12, and 13 include thereon a spiral conductor pattern 31,wiring patterns 21 and 22, and connector mounting electrodes 41 and 42.The first connector 51 is connected to the antenna substrate 301.

In the example shown in FIG. 36B, in the inductor bridge 116B, thewiring pattern 21 connected to the first connector 51 connected to theantenna substrate 301 is provided on a layer close to the metal pattern83 of the mother substrate 201. Therefore, the parasitic capacitancegenerated between the wiring pattern 21 and the metal pattern 83 islarge, and the influence on the antenna characteristics is comparativelylarge.

In contrast, in the example shown in FIG. 36A, in the inductor bridge116A, the wiring pattern 21 connected to the first connector 51connected to the antenna substrate 301 is provided on a layer fartheraway from the metal pattern 83 of the mother substrate 201 than thewiring pattern 22. Therefore, the parasitic capacitance generatedbetween the wiring pattern 21 and the metal pattern 83 is small, and theinfluence on the antenna characteristics is small.

Seventeenth Preferred Embodiment

FIG. 37 is a view showing a structure of a high frequency circuitequipped with an inductor bridge 117, an antenna substrate 301, and ametal member 84, according to a seventeenth preferred embodiment of thepresent invention. In this example, the inductor bridge 117 ispreferably used as the feed line of the antenna. In FIG. 37, since aportion (region indicated as A in FIG. 37) between the conductor patternconnected to the first connector 51 connected to the antenna substrate301 and a metal member (such as a battery pack and a shield plate of aliquid crystal display panel, for example) 84 exerts a large influenceon the antenna characteristics, the parasitic capacitance generated inthe portion is preferably small.

FIG. 38A and FIG. 38B are exploded perspective views showing a mountingstructure of the inductor bridge 117 shown in FIG. 37, and a positionalrelationship between the inductor bridge 117 and the metal member 84. InFIG. 38A and FIG. 38B, since the structures of the inductor bridges aredifferent from each other, different reference numerals 117A and 117Bare used to identify the inductor bridges, respectively.

In the both structures shown in FIG. 38A and FIG. 38B, the resin basematerials 11, 12, and 13 include thereon a spiral conductor pattern 31,wiring patterns 21 and 22, and connector mounting electrodes 41 and 42.The first connector 51 is connected to the antenna substrate 301.

In the example shown in FIG. 38B, in the inductor bridge 117B, thewiring pattern 21 connected to the first connector 51 connected to theantenna substrate 301 is formed on a layer close to the metal member 84.Therefore, the parasitic capacitance generated between the wiringpattern 21 and the metal member 84 is large, and the influence on theantenna characteristics is comparatively large.

In contrast, in the example shown in FIG. 38A, in the inductor bridge117A, the wiring pattern 21 connected to the first connector 51connected to the antenna substrate 301 is provided on a layer fartheraway from the metal member 84 than the wiring pattern 22. Therefore, theparasitic capacitance generated between the wiring pattern 21 and themetal member 84 is small, and the influence on the antennacharacteristics is small.

Eighteenth Preferred Embodiment

FIG. 39A and FIG. 39B are exploded perspective views of inductor bridges118A and 118B according to an eighteenth preferred embodiment of thepresent invention. The resin base materials 11 and 12 include thereonspiral conductor patterns 31 and 32 and wiring patterns 21, 22, and 23.

In this way, the spiral conductor patterns 31 and 32 are provided on thetwo-layer resin base materials 11 and 12, and the wiring pattern is alsoprovided on the two-layer resin base materials 11 and 12, whichconfigures an inductor bridge only by laminating the two-layer resinbase materials. It is to be noted that the outermost surface maypreferably include thereon a resist layer to protect the conductorpattern.

Nineteenth Preferred Embodiment

FIG. 40 is a view showing a structure of a high frequency circuitequipped with an inductor bridge 119, an antenna substrate 301, and ametal member 84, according to a nineteenth preferred embodiment of thepresent invention. In this example, the inductor bridge 119 ispreferably used as the feed line of the antenna.

FIG. 41A is a perspective view of the inductor bridge 119 shown in FIG.40, and FIG. 41B is an exploded perspective view showing a structure ofthe inductor bridge 119A, and a positional relationship between theinductor bridge 119 and the metal member 84. FIG. 41C is an explodedperspective view showing a structure of the inductor bridge 119B, and apositional relationship between the inductor bridge 119B and the metalmember 84. In FIG. 41B and FIG. 41C, since the structures of theinductor bridges are different from each other, different referencenumerals 119A and 119B are used to identify the inductor bridges,respectively.

In the both structures shown in FIG. 41B and FIG. 41C, the resin basematerials 11, 12, and 13 include thereon spiral conductor patterns 31and 32, wiring patterns 21 and 22, and connector mounting electrodes 41and 42. The first connector 51 is connected to the antenna substrate301.

In the example shown in FIG. 41C, in the inductor bridge 119B, thenumber of turns of the conductor pattern 32 provided on the resin basematerial 12 on a side close to the metal member 84 is larger than thenumber of turns of the conductor pattern 31 provided on the resin basematerial 11 on a side away from the metal member 84, so that a magneticfield to be generated in the inductor portion is likely to be preventedby the metal member 84. Therefore, a predetermined inductance isdifficult to be obtained. In addition, the parasitic capacitancegenerated between the conductor pattern 32 and the metal member 84 islarge.

In contrast, in the example shown in FIG. 41B, in the inductor bridge119A, the number of turns of the conductor pattern 32 provided on theresin base material 12 on a side close to the metal member 84 is smallerthan the number of turns of the conductor pattern 31 provided on theresin base material 11 on a side away from the metal member 84, so thata magnetic field to be generated in the inductor portion is unlikely tobe prevented by the metal member 84. Therefore, a reduction ininductance is small. In addition, the parasitic capacitance generatedbetween the conductor pattern 32 and the metal member 84 is also small.

Twentieth Preferred Embodiment

FIG. 42 is a view showing a structure of a high frequency circuitequipped with an inductor bridge 120, an antenna substrate 301, and ametal member 84, according to a twentieth preferred embodiment of thepresent invention. In this example, the inductor bridge 120 ispreferably used as the feed line of the antenna.

FIG. 43A is a perspective view of the inductor bridge 120, and FIG. 43Bis an exploded perspective view showing a structure of the inductorbridge 120, and a positional relationship between the inductor bridge120 and the metal member 84. The resin base materials 11, 12, and 13include thereon spiral conductor patterns 31 and 32, wiring patterns 21and 22, and connector mounting electrodes 41 and 42. The resin basematerials 11, 12, and 13 are laminated to configure an element body 10.The first connector 51 is connected to the antenna substrate 301.

FIG. 44A is a cross sectional view of the element body 10 of theinductor bridge 120. In this example, the conductor pattern 31 and theconductor pattern 32 face each other in the laminating direction. FIG.44B is an equivalent circuit diagram of the inductor bridge 120. In thisexample, the inductor L is mainly equivalent to the inductance by theconductor patterns 31 and 32, and the capacitor C is equivalent to thecapacitance generated between the conductor pattern 31 and the conductorpattern 32. The circuit configuration causes the inductor bridge 120 toact as a band elimination filter (BEF) and to have a function toattenuate a predetermined frequency band.

FIG. 45A is a cross sectional view of an inductor bridge of which theinternal structure is slightly different from the internal structure ofthe inductor bridge 120, and FIG. 45B is an equivalent circuit diagramof the inductor bridge in that case. In this example, compared to theexample shown in FIG. 44A, an area in which the conductor pattern 31 andthe conductor pattern 32 face each other in the laminating direction issmaller. The inductor L as shown in FIG. 45B is mainly equivalent to theinductance by the conductor patterns 31 and 32, and the capacitor C isequivalent to the capacitance generated between the conductor patterns31 and 32, and the metal member 84. The circuit configuration causes theinductor bridge to act as a low pass filter (LPF) and to have a functionto attenuate an unnecessary high frequency (high harmonic) component.

Twenty-First Preferred Embodiment

FIG. 46 is a view showing a structure of a high frequency circuitequipped with an inductor bridge 121, an antenna substrate 301, a metalmember 84, and a mother substrate 201, according to a twenty-firstpreferred embodiment of the present invention. FIG. 47 is a perspectiveview of the inductor bridge 121. In this example, the inductor bridge121 is preferably used as the feed line of the antenna.

FIG. 48A and FIG. 48B are partially exploded perspective views of theinductor bridge 121 and views showing a bending position at which theinductor bridge 121 is bent. All the resin base materials 11, 12, and 13include thereon a spiral conductor pattern 31, wiring patterns 21 and22, and a connector mounting electrode 42.

As shown in FIG. 48B, if the inductor bridge is to be bent at a positionin the middle of the wiring pattern 21, the inductor bridge receivesstress at an unexpected position, so that the bending position at whichthe inductor bridge is bent may shift even into the region in which thespiral conductor pattern is formed. In that case, as the spiralconductor pattern 31 deforms, the inductance varies.

On the other hand, as shown in FIG. 48A, if the inductor bridge is bentat the position of the interlayer connection conductor (via conductor)between the spiral conductor pattern 31 and the wiring pattern 22, thebending position does not vary and the bending position is fixed, sothat the inductance is prevented from varying unexpectedly.

FIG. 49A and FIG. 49B are other partially exploded perspective views ofthe inductor bridge 121 and views showing a position at which theinductor bridge 121 is bent.

As shown in FIG. 49B, if the inductor bridge receives stress at anunexpected position and the bending position at which the inductorbridge is bent shifts even into the region in which the spiral conductorpattern is provided, the inductance varies due to the deformation of thespiral conductor pattern 31.

On the other hand, as shown in FIG. 49A, if the inductor bridge includesa dummy interlayer connection conductor (via conductor) VIA provided soas to be bent at a position in the middle of the wiring pattern 21, theinductor bridge is bent at the position. Thus, the bending position doesnot vary and the bending position is fixed, so that the inductance isprevented from varying unexpectedly.

Twenty-Second Preferred Embodiment

FIG. 50A is a perspective view of an inductor bridge 123 according to atwenty-second preferred embodiment of the present invention, and FIG.50B is an exploded perspective view of the inductor bridge 123. Theinductor bridge 123 is an element configured to bridge-connect a firstcircuit and a second circuit by a two-terminal connector. As shown inFIG. 50A, the inductor bridge 123 is provided with a flexible flatplate-shaped element body 10, a first two-terminal connector 53, and asecond two-terminal connector 54.

As shown in FIG. 50B, the element body 10 is configured preferably bylaminating resin base materials 11, 12, 13, and 14 of a liquid crystalpolymer (LCP). The resin base materials 12 and 13 include an inductorportion defined by conductor patterns 31 and 32. The conductor patterns31 and 32 are spiral conductor patterns of which the coil axis isoriented in a direction perpendicular or substantially perpendicular tothe face of the resin base material 12 (direction perpendicular orsubstantially perpendicular to the principal surface of the element body10).

The resin base material 12 includes thereon wiring patterns 21 and 22,and the resin base material 14 includes thereon a wiring pattern 23. Theresin base material 11 includes thereon connector mounting electrodes41S and 42S and a ground electrode 40. The central conductors oftwo-terminal connectors 53 and 54 are connected to the connectormounting electrodes 41S and 42S, respectively, and the outer conductorsof the connector mounting electrodes 41S and 42S are connected to theground electrode 40.

The ground electrode 40 is configured to shield the inductor portion andto reduce or prevent undesired coupling with an external circuit. Inaddition, the ground electrode 40 also reduces or prevents undesiredcoupling with the conductors mainly provided on the substrate that isconnected to the inductor bridge and the metal member.

The inductance of the conductor pattern 31 is smaller than theinductance of the conductor pattern 32, and the conductor pattern ofwhich the inductance is smaller is close to the ground electrode 40, sothat the eddy current generated in the ground electrode 40 is reduced.

Twenty-Third Preferred Embodiment

FIG. 51A is a perspective view of an inductor bridge 124 according to atwenty-third preferred embodiment of the present invention, and FIG. 51Bis an exploded perspective view of the inductor bridge 124. As shown inFIG. 51B, the element body 10 is configured preferably by laminatingresin base materials 11, 12, 13, and 14. The resin base materials 12 and13 include an inductor portion defined by conductor patterns 31 and 32.The resin base material 12 includes thereon wiring patterns 21 and 22,and the resin base material 14 includes thereon a wiring pattern 23. Theresin base material 11 includes thereon connector mounting electrodes 41and 42 and a ground electrode 40. The ground electrode 40 includesthereon a conductive adhesive double sided tape 43.

In a state in which the inductor bridge 124 has been incorporated intoan electronic device, the conductive adhesive double sided tape 43 isadhered on the ground electrode and the metal member in the housing ofthe electronic device into which the inductor bridge 124 isincorporated. This enables a ground connection without using atwo-terminal connector. It should be noted that conductive adhesive maybe used in place of the conductive adhesive double sided tape in orderto make the ground connection.

Twenty-Fourth Preferred Embodiment

FIG. 52A is a perspective view showing the appearance of an inductorbridge 125 according to a twenty-fourth preferred embodiment of thepresent invention. FIG. 52B is an exploded plan view of the inductorbridge 125 according to the twenty-fourth preferred embodiment of thepresent invention. The inductor bridge 125 is bent upward along abending line LOF1 and bent downward along a bending line LOF2 and isused in the preferred embodiment as shown in FIG. 8, for example.

The element body 10 is configured by laminating resin base materials 11,12, 13, 14, and 15. The resin base material 11 includes a resist layer61 on the upper surface thereof, and the resin base material 15 includesa resist layer 62 on the lower surface thereof. The resist layers 61 and62 each include an opening portion. The resin base material 11 includesa wiring pattern 31 on the upper surface thereof. The resin basematerials 12 to 15 include loop-shaped conductor patterns 32 to 35 onthe lower surfaces thereof. The resin base materials 11 to 15 includeinterlayer connection conductors V1 to V5. The resin base material 11includes a connector mounting electrode 41 on the upper surface thereof,and the resin base material 15 includes a connector mounting electrode42 on the lower surface thereof.

On the resin base material 11, the conductor pattern 31 includes a firstend that is connected to the connector mounting electrode 41, and asecond end that is connected to the interlayer connection conductor V1.The interlayer connection conductor V1 is connected to the first end ofthe conductor pattern 32 provided on the resin base material 12. On theresin base material 12, the interlayer connection conductor V2 isconnected to the first end of the conductor pattern 32. The second endof the conductor pattern 32 is connected to the interlayer connectionconductor V3 provided on the resin base material 13. On the resin basematerial 13, the interlayer connection conductor V3 is connected to thefirst end of the conductor pattern 33. The second end of the conductorpattern 33 is connected to the interlayer connection conductor V4provided on the resin base material 14. On the resin base material 14,the interlayer connection conductor V4 is connected to the first end ofthe conductor pattern 34. The second end of the conductor pattern 34 isconnected to the interlayer connection conductor V5 formed on the resinbase material 15. On the resin base material 15, the interlayerconnection conductor V5 is connected to the first end of the conductorpattern 35. The second end of the conductor pattern 35 is connected tothe connector mounting electrode 42.

The connector mounting electrodes 41 and 42 are connected to theconnectors 51 and 52 through the opening portions of resist layers 61and 62. These conductor patterns and the interlayer connectionconductors define an inductor portion including a laminated coilpattern.

According to the present preferred embodiment of the present invention,various operational effects and advantages to be described below areachieved.

FIG. 53A and FIG. 53B are views showing stress applied to a conductorpattern near the bending portion. FIG. 53C is a perspective view of theinductor bridge 125 in a state of being bent. FIG. 53A and FIG. 53B showrepresentative examples of a part of the conductor patterns 32 and 34.As shown in FIG. 53A, the conductor patterns included in the inductorbridge 125 are formed to include a portion which intersects with thebending lines LOF1 or LOF2, the portion intersecting with the bendinglines LOF1 or LOF2 at a predetermined angle without being perpendicularor substantially perpendicular to each other. In other words, theinductor pattern has an approximate shape of an ellipse (leaf shape) ina plan view, the ellipse including a long axis that is patterned so asto be non-perpendicular to each of the bending lines LOF1 and LOF2 (sothat the long axis and the short axis of the ellipse are oblique withrespect to each of the bending lines LOF1 and LOF2).

The portion of the conductor pattern that intersects the bending linesLOF1 and LOF2 with each other preferably has an elliptical shape, whichdisperses the stress generated when the element body 10 is bent.Specifically, as shown in FIG. 53A, when the stress applied in thelonger direction of the resin base material 12 is represented by F, thestress applied to the conductor pattern 32 at a position in which theconductor pattern 32 and the bending line LOF1 are intersected with eachother is Fcose. Accordingly, the stress is reduced from F.

In addition, as shown in FIG. 53B, the conductor pattern 34 is curvednear the bending line LOF2. Such a curve hardly causes the conductorpattern 34 to be broken since the conductor pattern 34 deforms as theresin base material 14 deforms in the bending portion. For example, theconductor pattern 34 is located on a layer lower than the center of thethickness of the element body 10, so that the bending along the bendingline LOF2 applies tensile stress to the conductor pattern 34. Therefore,as shown by a dashed line in FIG. 53B, the conductor pattern 34 tends toextend straight in the vicinity of an intersecting position in which theconductor patterns 34 and the bending line LOF2 are intersected witheach other. In this way, the bending portion of the conductor patternhas previously curved and has a so called “bend allowance”, which causesthe conductor pattern to deform easily. Such an operation further easesthe stress applied to the conductor pattern.

Moreover, as shown in FIG. 52B, all the interlayer connection conductorsV1 to V5 are provided closer to the side of the connector mountingelectrode 42 than to the bending line LOF2. The conductor patterns 33and 35 connected to the interlayer connection conductors V3 and V5arranged at the position close to the bending line LOF2, between an areain which the conductor patterns 33 and 35 are overlapped with thebending line LOF2 and the interlayer connection conductors V3 and V5, asshown by being surrounded by the broken line in FIG. 52B, has a curvedshape (detour shape). Such a shape of the conductor pattern hardlycauses a break between the interlayer connection conductors V3 and V5and the conductor patterns 33 and 35 since the stress due to bending isnot directly transmitted to the interlayer connection conductors V3 andV5 when the element body 10 is bent along the bending line LOF2. It isto be noted that the distance from the bending line LOF2 to theinterlayer connection conductors V2 and V4 is large, so that theconductor patterns 32 and 34 are hardly broken without the curved shape(detour shape).

FIG. 54A is a plan view of the inductor bridge 125. FIG. 54A shows theelliptical shape of the conductor pattern in order to show therelationship between the conductor pattern of the inductor portion and abending position. FIG. 54B is a perspective view of the inductor bridge125 in a state of being bent.

As shown in FIG. 54A, the inductor bridge 125 includes an ellipticallyshaped conductor pattern of the inductor portion, the conductor patternhaving the long axis inclined with respect to the X axis. Therefore, theconductor pattern of the inductor portion is shifted from a region A toa region B, furthermore, from the region B to a region C, in the in thepositive direction of Y-axis. With such a structure, compared to a casein which the long axis of the elliptical shape is oriented in the X-axisdirection, the distance between the lines of the conductor patterns overthe adjacent regions becomes larger. For example, when the long axis ofthe elliptical shape is oriented in the X axial direction, and theconductor pattern in the region A and the conductor pattern in theregion C are bent upward along the bending line LOF1 and bent downwardalong the bending line LOF2, the conductor pattern of the region A andthe conductor pattern of the region C become closer to each other. Incontrast, according to the present preferred embodiment of the presentinvention, the conductor patterns of the portion shown by the dashedline in FIG. 54A are not much close to each other even by the bending.Therefore, the inter-line capacitance of the conductor pattern of theinductor portion does not become large, which makes it possible to keepthe self-resonant frequency high.

In addition, if the element body 10 is flexible, the angle (bendingangle) defined by the region A and the region B of the element body 10,and the angle (bending angle) defined by the region B and the region Cof the element body 10 are hardly kept constant. As described above,according to the present preferred embodiment of the present invention,the increase in inter-line capacitance by bending is small, so that, dueto various bending shapes, the change in electrical characteristics asan inductor element is also small.

Moreover, as is clear when referring to FIG. 52B, FIG. 54A, and FIG.54B, the interlayer connection conductor is not provided in the regionB. Since the interlayer connection conductor is made of a hard material,a portion in which the interlayer connection conductor is provided ismore difficult to deform, compared to a portion in which the interlayerconnection conductor is not provided. Therefore, compared to theconfiguration in which the interlayer connection conductor is providedin the region B, the bending along the bending lines LOF1 and LOF2 iseasier.

Furthermore, when the interlayer connection conductor is provided in theregion B, the conductor pattern of the inductor portion includes in themiddle thereof a corner portion (step-shaped portion) defined by theinterlayer connection conductor in a cross sectional view. Such a cornerportion of the conductor pattern causes a loss of high frequency.According to the present preferred embodiment of the present invention,the conductor pattern of the inductor portion includes in the middlethereof no interlayer connection conductors, which significantly reducesthe loss.

It should be noted that, while the preferred embodiments shown in FIGS.52A and 52B to FIGS. 54A and 54B describe an example in which theinductor bridge is bent along the two bending lines LOF1 and LOF2parallel to each other, one bending line may also be used to obtain asimilar effect.

Twenty-Fifth Preferred Embodiment

FIG. 55A is a perspective view of an inductor bridge 126 according to atwenty-fifth preferred embodiment of the present invention, and FIG. 55Bis an exploded perspective view of the inductor bridge 126. The inductorbridge 126 includes an element body 10 and an inductor in the elementbody 10. The element body 10 includes connectors 51 and 52 on the outersurface thereof. As shown in FIG. 55B, the element body 10 is configuredpreferably by laminating resin base materials 11, 12, 13, and 14. Theresin base materials 12 and 13 include on the lower surface thereof aninductor portion defined by conductor patterns 31 and 32. In addition,the resin base materials 12 and 13 include thereon wiring patterns 21and 22. The resin base material 11 includes a connector mountingelectrode 42, and the resin base material 14 includes a connectormounting electrode 41.

While all the preferred embodiments that have been shown so far havedescribed an example in which the element body 10 includes opposite endportions that each include a connecting portion, the following preferredembodiment of the present invention describes an example in which atleast one of the two connecting portions is provided at a positiondifferent from the position of the end portion of the element body 10.

The main features of the inductor bridge 126 of the present preferredembodiment of the present invention are that: the inductor iselectrically connected between the two connectors 51 and 52; in themechanical structure, the inductor portion is arranged at a portionother than an area between the two connectors 51 and 52; and the portionother than the area between the two connectors 51 and 52 is bent.

FIG. 56A is a perspective view showing a state in which the inductorportion of the inductor bridge 126 (portion other than the area betweenthe two connectors 51 and 52) is bent from a portion other than theinductor portion. FIG. 56B and FIG. 56C are views showing a state inwhich the inductor bridge 126 is mounted to the mother substrate 201together with other components. FIG. 56B and FIG. 56C show the crosssectional surface of the mother substrate 201.

In the example shown in FIG. 56B, the inductor bridge 126 is mounted tothe mother substrate 201 in a state in which the connector 51 of theinductor bridge 126 is connected to the connecting portion on the mothersubstrate 201. The connector 52 of the inductor bridge 126 is connectedto a sub substrate 302. The mother substrate 201 includes a mountingcomponent 160 mounted thereto, and the inductor portion of the inductorbridge 126 is located in a clearance between the mounting component 160and the sub substrate 302.

While the inductor portion includes many conductor patterns and isdifficult to be bent, the portion other than the inductor portion iseasy to be bent. Thus, as shown in FIG. 56A and FIG. 56B, the inductorbridge is likely to be bent at a boundary between the inductor portionand the portion other than the inductor portion. Since the inductorportion stands perpendicular or substantially perpendicularly to themother substrate 201, it is easy to arrange the inductor portion in anarrow space between components. Moreover, a required plane area isreduced. Furthermore, in a case in which the mother substrate 201includes thereon a metal pattern (such as a ground conductor pattern)83, the inductor portion of the inductor bridge 126 includes a coil axisthat is perpendicular or substantially perpendicular to the metalpattern 83, which prevents an eddy current from being generated in themetal pattern 83 and suppresses loss, and change in inductance.

In the example shown in FIG. 56C, the inductor bridge 126 in a flatplate state is mounted to the mother substrate 201. In this way, theinductor bridge 126 is able to be arranged without being bent, asneeded.

Twenty-Sixth Preferred Embodiment

FIG. 57A is a perspective view of an inductor bridge 127 according to atwenty-sixth preferred embodiment of the present invention, and FIG. 57Bis an exploded perspective view of the inductor bridge 127. The inductorbridge 127 includes an element body 10 and an inductor in the elementbody 10. The element body 10 includes connectors 51 and 52 on the outersurface thereof. As shown in FIG. 57B, the element body 10 is configuredpreferably by laminating resin base materials 11, 12, 13, and 14. Theresin base materials 12 and 13 include on the lower surface thereof aninductor portion defined by conductor patterns 31 and 32. In addition,the resin base materials 12 and 13 include thereon wiring patterns 21and 22. The resin base material 11 includes a connector mountingelectrode 42, and the resin base material 14 includes a connectormounting electrode 41.

The main features of the inductor bridge 127 of the present preferredembodiment of the present invention are that: the inductor iselectrically connected between the two connectors 51 and 52; in themechanical structure, the inductor portion is arranged at a portiondifferent from a portion on a line connecting the two connectors 51 and52; the portion that is not on the line between the two connectors 51and 52 is bent; and the inductor bridge is bent along a line parallel orsubstantially parallel to the line connecting the two connectors 51 and52.

FIG. 58A and FIG. 58B are views showing a state in which the inductorbridge 127 is mounted to the mother substrate 201 together with othercomponents. The first connector 51 of the inductor bridge 127 isconnected to the connecting portion on the mother substrate 201. Thesecond connector 52 of the inductor bridge 127 is connected to a subsubstrate 302. The mother substrate 201 includes a mounting component161 mounted thereto.

In particular, in the example shown in FIG. 58A, the inductor portion ofthe inductor bridge 127 rises so as not to interfere with the mountingcomponent 161. Since the inductor portion rises perpendicular orsubstantially perpendicularly to the mother substrate 201, it is easy toarrange the inductor portion in a narrow space between components.

Moreover, in the example shown in FIG. 58B, the inductor portion of theinductor bridge 127 does not stand, and the inductor bridge 127 isarranged on the mother substrate 201 so that the inductor portion maynot interfere with the mounting component 161.

In this way, the inductor portion preferably is provided at a portiondifferent from a portion on a line connecting the two connectors. Theconfiguration, even when a distance between the two connectors is notsecured, generates a predetermined large inductance.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

What is claimed is:
 1. An inductor bridge comprising: a flexible flatplate-shaped element body; a first connecting portion that is providedon the element body and structured to be connected to a first circuit; asecond connecting portion that is provided on the element body andstructured to be connected to a second circuit; and an inductor portionthat is connected between the first connecting portion and the secondconnecting portion; wherein the inductor portion includes a plurality ofconductor patterns of which a coil axis is oriented in a directionperpendicular or substantially perpendicular to a principal surface ofthe element body; the plurality of conductor patterns are provided overa plurality of layers; and the plurality of conductor patterns areconnected in parallel to each other.
 2. The inductor bridge according toclaim 1, wherein the first connecting portion is provided on a first endportion of the element body; the second connecting portion is providedon a second end portion of the element body; and the element bodyincludes a bending portion between the first end portion and the secondend portion.
 3. The inductor bridge according to claim 2, wherein thebending portion is arranged at a position other than a line passingthrough a center of the inductor portion.
 4. The inductor bridgeaccording to claim 1, wherein the first connecting portion is structuredto be electrically connected to the first circuit by mechanical contactand the second connecting portion is structured to be electricallyconnected to the second circuit by mechanical contact.
 5. The inductorbridge according to claim 1, wherein the element body has a longerdirection; and the inductor portion includes a meander line-shapedconductor pattern of which lines that are adjacent to each other eachextend in the longer direction of the element body.
 6. The inductorbridge according to claim 1, wherein the element body has a shorterdirection; and the inductor portion includes a meander line-shapedconductor pattern of which lines that are adjacent to each other eachextend in the shorter direction of the element body.
 7. The inductorbridge according to claim 1, wherein the element body further includestwo shield conductor patterns that interpose the inductor portionbetween the shield conductor patterns in a laminating direction.
 8. Theinductor bridge according to claim 1, wherein the plurality of conductorpatterns have a helical shape over the plurality of layers; theplurality of conductor patterns are provided in a position in which theplurality of conductor patterns face each other between the plurality oflayers; and among the plurality of conductor patterns, a line width ofthe conductor pattern that is closest to the first connecting portion ona path and a line width of the conductor pattern that is closest to thesecond connecting portion on a path are thinner than a line width of theconductor patterns of other layers.
 9. The inductor bridge according toclaim 1, wherein the plurality of conductor patterns have a helicalshape over the plurality of layers; the plurality of conductor patternsare provided in a position in which the plurality of conductor patternsface each other between the plurality of layers; the plurality ofconductor patterns includes: a first conductor pattern that is closestto the first connecting portion or the second connecting portion on apath; and a second conductor pattern of a layer that is adjacent to thefirst conductor pattern; and a distance between the first conductorpattern and the second conductor pattern is larger than a distancebetween the conductor patterns in other layers that are adjacent to thefirst conductor pattern.
 10. An electronic device comprising: theinductor bridge according to claim 1; the first circuit; and the secondcircuit; wherein the first circuit and the second circuit are connectedto each other through the inductor bridge.
 11. An electronic devicecomprising: the inductor bridge according to claim 1; and a planarconductor; wherein a layer on which a conductor pattern of the pluralityof conductor patterns with a larger number of turns among the pluralityof conductor patterns is provided is arranged on a layer spaced fartheraway from the planar conductor.
 12. An electronic device comprising theinductor bridge according to claim 1, wherein: the plurality ofconductor patterns are provided in a position in which the plurality ofconductor patterns face each other between the plurality of layers. 13.An electronic device comprising: the inductor bridge according to claim1; and a planar conductor; wherein the plurality of conductor patternsare provided in a position in which a capacitance is generated betweenthe plurality of conductor patterns and the planar conductor.
 14. Theelectronic device according to claim 13, wherein the capacitance and theinductor portion define a low pass filter.